1.0 Kurtz Ersa Smart Production GmbHhttps://kurtz-ersa-smart-production.com/en/adminhttps://kurtz-ersa-smart-production.com/en/author/bg1440/rich600338<blockquote class="wp-embedded-content" data-secret="AKdfYYa0vh"><a href="https://kurtz-ersa-smart-production.com/en/underfill/">Underfill</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://kurtz-ersa-smart-production.com/en/underfill/embed/#?secret=AKdfYYa0vh" width="600" height="338" title="“Underfill” — Kurtz Ersa Smart Production GmbH" data-secret="AKdfYYa0vh" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script> /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); //# sourceURL=https://kurtz-ersa-smart-production.com/wp-includes/js/wp-embed.min.js </script> https://kurtz-ersa-smart-production.com/wp-content/uploads/2023/05/underfill.jpg960540Underfill Complex microelectronic components, which have their contact area below the component (i.e. BGA) are mounted and contacted onto substrates using pick and place processes or even flip chip processes. To increase the bonding properties and to avoid contamination a process called underfill is used. Thereby, a viscous underfill material is applied close to the […]