{"id":10559,"date":"2022-12-05T10:43:19","date_gmt":"2022-12-05T09:43:19","guid":{"rendered":"https:\/\/staging.haecker-automation.de\/smd-bestuecken-automation\/"},"modified":"2025-12-12T11:43:53","modified_gmt":"2025-12-12T10:43:53","slug":"pcb-assembly-and-3d-assembly","status":"publish","type":"page","link":"https:\/\/kurtz-ersa-smart-production.com\/en\/pcb-assembly-and-3d-assembly\/","title":{"rendered":"PCB assembly and 3D assembly"},"content":{"rendered":"\t\t
\n\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

PCB assembly and 3D assembly.\n\n\n\n\n<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

Highly precise and efficient.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

\n\t\t\t\t\t
\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

AUTOMATE THE PRODUCTION OF YOUR MICRO AND NANO COMPONENTS.\n\n\n\n\n\n\n<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\tAutomation systems from H\u00e4cker Automation are your equipment to realise diverse process steps.\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\tThe precise assembly of printed circuit boards as well as highly sensitive and geometrically demanding components in the micro and nano range have many influencing variables that affect the perfect result. From placement in extremely deep cavities to placement of touch-sensitive components, in our portfolio you will find the clever solution for your individual needs.\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t\t
\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

3D placement.\n\n \n\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

HIGH PRECISION PLACEMENT THROUGH COMPONENT ALIGNMENT WITH A HexaPOD.\n\n\n \n\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

One of the many options of modules in our systems is the use of a Hexapod for high-precision alignment of substrates and components. This allows manipulation in six degrees of freedom with positioning accuracies less than 10nm.To illustrate this, you can see a demonstration process in our linked video.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

\n\t\t\t\t
\n\t\t\t\t\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t\n\t\t\t\t\t
HIGH PRECISION ASSEMBLY WITH A hexaPOD <\/div><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

Process steps shown in the video:<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

1. The ceramic substrate is measured at 3 positions with the 3D camera to determine the 3D position of the substrate (0-3 sec).<\/p>\n

2. The hexapod moves to a correction position to the position determined in step 1 (3-4 sec).<\/p>\n

3. The substrate is measured a second time (4-7 sec).<\/p>\n

4. The hexapod makes another correction movement (8 sec).<\/p>\n

5. The substrate is measured a third time and the result is found to be good (9-13 sec).<\/p>\n

6. The Hexapod moves to the measuring position for the height measurement of the bond surface (13- 14 sec).<\/p>\n

7. The linear axis with the measuring head of the confocal sensor moves into the measuring position \u2013 the exact height of the bond area is measured (15- 16 sec).<\/p>\n

8. The linear axis with the measuring head of the confocal sensor moves back to the rest position (17 \u2013 19 sec).<\/p>\n

9. The hexapod moves back to the position it had reached in the 4th step (19 \u2013 20 sec).<\/p>\n

10. The placement head fetches an invisible component from the wafflepack holder (20 \u2013 24 sec).<\/p>\n

11. The placement head moves the component over the placement position (24 \u2013 28 sec).<\/p>\n

12. The hexapod moves the last millimeter towards the placement head to press on the invisible component in a defined way (29 sec).<\/p>\n

13. The placement head puts down the invisible component and moves back to the overtravel height (30 -32 sec).<\/p>\n

14. The hexapod moves back to its starting position (33 sec).<\/p>\n

15. The process starts again from the beginning.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t
\n\t\t\t
<\/div>\t\t\t\t
\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t
\n\t\t\t\t\t\t\t<\/path><\/svg>\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t\t
\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

Secure processing of sensitive components.\n\n \n\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

Meet demanding component handling with a new placement head.\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

The processing of sensitive components is a particular challenge in process design. Secure release from the feeding system, the high risk of damage during pick-up or subsequent placement with a defined immersion depth in a dispensing medium are tasks that must be realized during the placing process.
H\u00e4cker Automation developed the PLACER TD<\/strong>, a touchdown placer for these complex process steps.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

\n\t\t\t\t
\n\t\t\t\t\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t\n\t\t\t\t\t
more <\/div><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

This placement head was designed for the precise alignment and placement of components. It is used, for example, when placement is to be carried out on pressure-sensitive substrates or when extremely precise measurement of the substrate height is required.
For this purpose, the placer has an inductive distance sensor in the Z direction, which detects when the component touches down on the surface of the substrate.
It is also possible to position the component in the Z-direction at a defined depth in a viscous or liquid medium.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t
\n\t\t\t\t\t\n\t\t\t\t\t\t\n\t\t\t\t\t\t\n\t\t\t\t<\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\tdatasheet<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t
\n\t\t\t\t\t\t\t<\/path><\/svg>\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t\t
\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

DIE BONDING.\n\n \n\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\tTake your die bonding process to a whole new level. Increasing product miniaturization and volatile markets are pushing traditional chip processing to its limits. Extensive dispensing equipment is available for applying your preferred bonding material. With the help of bonding tool sets and intelligent placement technology, we guarantee the safe and precise handling of your dies. The entire bonding equipment is based on a modular concept and reusable as well as replaceable.\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t\t
\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

DIE sorting as a pre-process of die bonding.\n\n\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\tAt the beginning of the process, the dies\/chips are located on a wafer that is clamped in a frame.\n\nIn order to carry out sorting successfully, it is important to know in which area the needle and the pickup tool are allowed to manipulate the component. Both may only touch the component in this area, otherwise damage may occur and functionality is no longer guaranteed. \n\nWhen ejecting the components, always ensure that no splintering occurs at these points.\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t\n\t\t\t\t\t
more <\/div><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\tFor this pickup process, a wafer eject unit (also called die eject unit) as well as suitable needles and rubber or steel tools are used. If sensitive substrate surfaces are involved on which no residues must remain, the use of a steel tool is recommended.\n\nAttention must be paid to the parameters while ejecting and picking up, such as approach heights, pick-up heights, needle start heights, exit heights, speed and waiting time.\n\nThe picked-up parts are then checked for position and fractures using a bottom-side camera, and the good parts are sorted into a feeding system, for example a gel pack or a waffle pack.\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\tFig. 1: Product on a wafer.\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\"\"\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t\t
\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

DIE Bonding.\n \n\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\tFig.2: Versuchsaufbau for test setup for DIE Bonding.\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\"\"\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

Substrate feeding and supply is realized, for example, by means of a boat and a carrier on a vacuum support. Before the actual bonding process, the individual positions on the substrate that are inspected. These positions are used as references for the placement.<\/p>\n

The appropriate dispensing material is then applied. In the process example shown, this is done by means of a pin transfer process on the Direct Dispensing Unit.<\/p>\n

The wetted chip is then placed on the substrate. Afterwards, an automatic optical inspection of the products is realised.<\/p>\n

\u00a0<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t\t
\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

Flip chip assembly.\n\n \n\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

ASSEMBLY AND INTERCONNECTION TECHNOLOGY FOR COMPLEX MICROELECTRONICS.\n\n\n \n\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\tComplex electronic circuits are increasingly being implemented as integrated semiconductors. It is effective to provide the inputs and outputs for control signal transmission on the underside of the component in the form of an array. In addition to shorter runtimes, this also offers advantages in terms of heat dissipation.\n\nDue to the semiconductor manufacturing process, the conductive tracks of a chip are located on the top side of the wafer. Therefore, it is necessary to flip the components prior to placement. This process is known as flip-chip assembly. Flip-chip assembly systems must ensure exceptional accuracies due to the small distances between the contact pads and their array-shaped arrangement.\n\nIn addition to positioning in the area (X and Y), rotation about the Z-axis (theta) of the placement head is critical.\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t\n\t\t\t\t\t
more <\/div><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\tH\u00e4cker Automation offers an integrated process solution for flip chip assembly. The first process step requires the application of a conductive adhesive or solder paste to the substrate to enable subsequent contacting either by UV light or heat. The flip-chip process itself begins with the ejection of individual wafer chips from a diced wafer mounted on a tape in a frame. Different wafer diameters and chips with different sizes and thicknesses can be used. The ejection system is a fixed component and can be easily replaced when switching to other products. Even highly sensitive and thin dies can be processed.\n\nThe turning station takes care of turning the component, which can then be placed on the substrate at the desired position. The high-precision gantry system of the VICO basic machine ensures the required placement accuracy. The necessary placement accuracy of better than 10 \u00b5m is ensured by the optionally available camera systems and the error correction algorithms in the control software. The semiconductor dies can be placed on the substrate as bare dies or further processed into packages such as BGAs.\n\nA flip-chip process solution can be extended with dispensing processes such as glob top, conformal coating or other micro-assembly technologies such as 3D assembly.\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t
\n\t\t\t
<\/div>\t\t\t\t
\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t
\n\t\t\t\t\t\t\t<\/path><\/svg>\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t\t
\n\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

ALSO INTERESTING FOR YOU?\n\n\n \n\n\n\n\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t