{"id":12444,"date":"2023-05-31T09:43:40","date_gmt":"2023-05-31T07:43:40","guid":{"rendered":"https:\/\/haecker-automation.de\/?p=12444"},"modified":"2023-11-15T15:38:48","modified_gmt":"2023-11-15T14:38:48","slug":"pin-transfer-of-solder-paste-and-pick-place-of-smd-components-on-pcb","status":"publish","type":"post","link":"https:\/\/kurtz-ersa-smart-production.com\/en\/pin-transfer-of-solder-paste-and-pick-place-of-smd-components-on-pcb\/","title":{"rendered":"Pin Transfer of Solder Paste and Pick &#038; Place of SMD components on PCB"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"12444\" class=\"elementor elementor-12444 elementor-6238\" data-elementor-post-type=\"post\">\n\t\t\t\t<div class=\"elementor-element elementor-element-2a9eb3a8 e-flex e-con-boxed e-con e-parent\" data-id=\"2a9eb3a8\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b4cb1e5 elementor-widget elementor-widget-theme-post-title elementor-page-title elementor-widget-heading\" data-id=\"b4cb1e5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"theme-post-title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">Pin Transfer of Solder Paste and Pick &#038; Place of SMD components on PCB<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-55cd55f e-flex e-con-boxed e-con e-parent\" data-id=\"55cd55f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-37819e0 e-con-full e-flex e-con e-child\" data-id=\"37819e0\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e3c9758 elementor-widget elementor-widget-heading\" data-id=\"e3c9758\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Pin Transfer of Solder Paste and Pick &amp; Place of SMD components on PCB\n<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e3992d1 elementor-widget elementor-widget-text-editor\" data-id=\"e3992d1\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p class=\"md-end-block md-p\"><span class=\"md-plain md-expand\">The process in Vid. 1 is conducted on a standard machine using standard components of the OurPlant platform and comprises several steps for assembling dies on a PCB.<\/span><\/p><p class=\"md-end-block md-p\"><span class=\"md-plain\">The system is equipped with Direct Dispensing Station (DDS) for processing pin transfer as well as areal application of solder paste on the component&#8217;s subside. Different steps from pin transfer over standard pick &amp; place processes to direct dispensing processes of different SMD components on a PCB are shown in the video.<\/span><\/p><p class=\"md-end-block md-p md-focus\"><span class=\"md-plain\">The pin transfer is roughly a stamping process. So, in case of the pin transfer a tool transfers solder paste on the PCB. After dispensing solder paste on the pads of the PCB, SMD parts are picked up from a Waffle Pack and subsequently placed on the substrate. The smallest SMD component has a size of 0.3mm \u00d7 0.3mm. There are also tool changing units inside the working area, which can host different tools for pin transfer and pick &amp; place purposes.<\/span><\/p><p class=\"md-end-block md-p\"><span class=\"md-plain md-expand\">Larger components can be applied using the direct dispensing capabilities of the DDS. Therefore the component is dipped into a reservoir of solder paste provided by the DDS. The shape of the solder paste layer is formed using a foil onto a matrix using vacuum to deform the foil according to the matrix pattern. Thus, the solder paste is applied with a defined pattern at the component as a part of the pick&amp;place process.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-64a4a0a e-flex e-con-boxed e-con e-parent\" data-id=\"64a4a0a\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e769206 elementor-widget elementor-widget-video\" data-id=\"e769206\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;youtube_url&quot;:&quot;https:\\\/\\\/youtu.be\\\/1EPjSr6kcDU&quot;,&quot;mute&quot;:&quot;yes&quot;,&quot;loop&quot;:&quot;yes&quot;,&quot;yt_privacy&quot;:&quot;yes&quot;,&quot;lazy_load&quot;:&quot;yes&quot;,&quot;video_type&quot;:&quot;youtube&quot;,&quot;controls&quot;:&quot;yes&quot;}\" data-widget_type=\"video.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-wrapper elementor-open-inline\">\n\t\t\t<div class=\"elementor-video\"><\/div>\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Pin Transfer of Solder Paste and Pick &#038; Place of SMD components on PCB The process in Vid. 1 is conducted on a standard machine using standard components of the OurPlant platform and comprises several steps for assembling dies on a PCB. The system is equipped with Direct Dispensing Station (DDS) for processing pin transfer [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":3310,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[38],"tags":[],"class_list":["post-12444","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-dosieren-en"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Pin Transfer of Solder Paste and Pick &amp; Place of SMD components on PCB | Kurtz Ersa Smart Production GmbH<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/kurtz-ersa-smart-production.com\/en\/pin-transfer-of-solder-paste-and-pick-place-of-smd-components-on-pcb\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Pin Transfer of Solder Paste and Pick &amp; Place of SMD components on PCB | Kurtz Ersa Smart Production GmbH\" \/>\n<meta property=\"og:description\" content=\"Pin Transfer of Solder Paste and Pick &#038; Place of SMD components on PCB The process in Vid. 1 is conducted on a standard machine using standard components of the OurPlant platform and comprises several steps for assembling dies on a PCB. 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